Thermal fluid-structure interaction in the effects of pin-through-hole diameter during wave soldering

M. S. Abdul Aziz, and M. Z. Abdullah, and C. Y. Khor, and Z. M. Fairuz, and Muhammad Iqbal Ahmad, and Mazlan Mohamed, and Mohd Sukhairi Mat Rasat, (2014) Thermal fluid-structure interaction in the effects of pin-through-hole diameter during wave soldering. [Indexed Article]

Official URL: http://www.hindawi.com/journals/ame/2014/275735/

Abstract

An effective simulation approach is introduced in this paper to study the thermal fluid-structure interaction (thermal FSI) on the effect of pin-through-hole (PTH) diameter on the wave soldering zone. A 3D single PTH connector and a printed circuit board model were constructed to investigate the capillary flow behavior when passing through molten solder (63SnPb37). In the analysis, the fluid solver FLUENT was used to solve and track the molten solder advancement using the volume of fluid technique. The structural solver ABAQUS was used to examine the von Mises stress and displacement of the PTH connector in the wave soldering process. Both solvers were coupled by MpCCI software. The effects of six different diameter ratios (0.1 <

Item Type: Indexed Article
Faculty: Faculty of Earth Sciences
Deposited By: En. Pahmi Abdullah
Date Deposited: 11 Dec 2014 05:48
Last Modified: 07 Mar 2016 08:49
URI: http://umkeprints.umk.edu.my/id/eprint/3345

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