Numerical investigation of heat transfer of twelve plastic leaded chip carrier (PLCC) by using computational fluid dynamic, FLUENT TM software

Mazlan Mohamed, and A.Rahim, and Muhamad Iqbal Ahmad, and Abdullah Mohd Mustafa Al Bakri, and Razak Wahab, and H.M Nor Hakim, (2013) Numerical investigation of heat transfer of twelve plastic leaded chip carrier (PLCC) by using computational fluid dynamic, FLUENT TM software. Advanced Materials Research, 795. pp. 603-610. ISSN 1662-8985

Official URL: http://dx.doi.org/10.4028/www.scientific.net/AMR.7...

Abstract

Plastic Leaded Chip Carrier (PLCC) package has been emerged a promising option to tackle the thermal management issue of micro-electronic devices. In the present study, three dimensional numerical analysis of heat and fluid flow through PLCC packages oriented in-line and mounted horizontally on a printed circuit board, is carried out using a commercial CFD code, FLUENTTM. The simulation is performed for 12 PLCC under different inlet velocities and chip powers. The contours of average junction temperatures are obtained for each package under different conditions. It is observed that the junction temperature of the packages decreases with increase in inlet velocity and increases with chip power. Moreover, the increase in package density significantly contributed to rise in temperature of chips. Thus the present simulation demonstrates that the chip density (the number of packages mounted on a given area), chip power and the coolant inlet velocity are strongly interconnected; hence their appropriate choice would be crucial

Item Type: Non-Indexed Article
Keywords: Microprocessors - Thermal Management - Plastic Leaded Chip Carrier
Faculty: Faculty of Earth Sciences
Deposited By: Mr Mazlan Mohamed
Date Deposited: 27 Sep 2013 04:53
Last Modified: 27 Sep 2013 04:53
URI: http://umkeprints.umk.edu.my/id/eprint/2168

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